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Making particle quality visible

GreCon PARTICLEVIEW

Home Measuring Technology Products PARTICLEVIEW

Strength, glue consumption, surface quality: the geometry of the chips determines the properties of the boards. GreCon PARTICLEVIEW provides the data needed to control chip geometry – continuously, accurately and in line with the application.

Your added value with GreCon PARTICLEVIEW

  • Inline or atline chip geometry measurement
  • Measures length, width, thickness, area, volume and alignment
  • Detects even the smallest irregularities
  • Prevents rejects and quality loss
  • Optimises glue consumption and material usage
  • Early warning system for screen or chipper problems
  • Saves manual sampling and staff time
  • Provides real-time data for process control
  • Transfers geometry data to control systems

Why particle geometry matters in your production

Even small deviations in chip geometry affect strength, appearance and gluing and can lead to high, avoidable costs. PARTICLEVIEW provides the necessary transparency – either inline during the running process or in the laboratory for targeted quality assurance. Two systems, one goal: optimum chipboard quality.

PARTICLEVIEW in comparison – which solution suits your line?

CriterionPARTICLEVIEW 2DPARTICLEVIEW 3D
Measuring principleCamera-based, inlineLaser-based, atline
Measurable parametersLength, width, alignmentLength, width, thickness, area, volume
SamplingAutomatic from the running lineManual or automated via dosing unit
Sample quantityVery large, as continuousSmall (manual) or medium (with dosing unit)
Installation locationAfter the scatter head / middle layer of the matAfter dryer / after chipping / in the laboratory
Typical applicationProduction monitoringProcess control & optimisation
Visualisation & interfacesWeb interface, data export to control systemWeb interface, data export to control system

 

How PARTICLEVIEW systems work

A camera captures the middle layer particles contactlessly from above. An AI algorithm recognises and measures individual particles. The size distribution is statistically evaluated and displayed immediately.

Inline, continuous, automated

  • Installation directly after the spray head (middle layer)
  • Camera-based, contactless
  • AI-supported segmentation of the particles
  • Real-time statistics on particle distribution
  • Data for glue optimisation and quality forecasting

Particle samples are separated using a vibrating feeder. Lasers measure all three dimensions without contact. The software also determines the volume and surface area of the particles.

In-line, precise, flexible

  • Measurement in the laboratory or directly in the line (after dryer, shredder)
  • Optional dosing unit for automated sampling
  • Records length, width, thickness – calculates volume and surface area
  • Ideal for correlation with plate properties
  • Low personnel requirements thanks to automation

 

Two variants – one goal: controlled particle geometry

>> PARTICLEVIEW 2D <<

>> PARTICLEVIEW 3D <<

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Gre­Con PAR­TI­CLE­VIEW 3D with monitor and software applied in front of concrete wall
Gre­Con PAR­TI­CLE­VIEW 3D Laboratory chip measurement using laser technology

PARTICLEVIEW 2D

Particle geometry as a quality factor in chipboard production

The geometry of the wood particles has a significant influence on the properties of the finished chipboard. In particular, the ratio of surface area to volume determines how effective the glue application is – and thus how stable and high-quality the end product will be.

Irregular particles lead to fluctuating board quality, increased glue consumption and visible surface defects. PARTICLEVIEW 2D detects such deviations at an early stage – before rejects are produced.

Precise inline measurement for better processes

Where previously only random samples or indirect process controls were possible, GreCon PARTICLEVIEW 2D ensures continuous inline monitoring of particle geometry – in real time and without interrupting the production flow.

The data collected provides the basis for targeted optimisation of chipping and gluing. Problems such as clogged screens or wear and tear on the chipper are detected in good time. This enables manufacturers to take targeted countermeasures, stabilise their processes and increase material efficiency.

Gre-Con PAR-TICLE-VIEW 2D rendering against a grey-white background
GreCon PARTICLEVIEW 2D detects process problems in chipboard production before rejects occur
Colourful wood particles in the scan
GreCon PARTICLEVIEW 2D determines the length and width of particles without contact using its camera measurement system – directly above the mat.

How PARTICLEVIEW 2D works in detail

The geometry of wood particles plays a decisive role in the production of chipboard – especially when it comes to the effectiveness of glue application and the mechanical properties of the finished board. Depending on the shape and size of the particles, the ratio of surface area to volume changes – a key parameter for quality.

These properties are largely determined by the chipping process. Changes, for example due to wear or the setting of the knives in the chipping unit (knife ring flaker), have a direct impact on the particle shape – and thus on the subsequent board quality.

The GreCon PARTICLEVIEW 2D continuously monitors this geometry directly in the production line. The system automatically measures the length and width of the particles using state-of-the-art image processing. Continuous data acquisition results in a particularly large and therefore representative sample – far more meaningful than traditional methods such as sieve analysis or manual measurement.

This makes the development of particle quality continuously visible – a reliable basis for process optimisation, resource conservation and consistently high product quality.

Clear advantage over conventional methods

Unlike traditional methods such as sieve analysis or manual measurement, GreCon PARTICLEVIEW 2D provides continuous and automated recording of particle geometry – directly in the process.

While sieve analysis usually only records a single particle dimension and the result is heavily dependent on the sieving time, PARTICLEVIEW 2D simultaneously measures the length and width of each individual particle – without contact and without interruption. Manual particle measurement is also time-consuming, susceptible to subjective influences and based on very small samples.

PARTICLEVIEW 2D, on the other hand, provides a comprehensive, reproducible picture of particle distribution – for greater transparency, more control and better decisions during the ongoing process.

PARTICLEVIEW 3D

Chip geometry analysed at a glance

GreCon PARTICLEVIEW 3D is a measuring device for the objective assessment of chip quality and chip measurement. Chip geometry is a decisive factor for the mechanical properties of the subsequent chipboard.

The chip surface area in relation to the volume is the decisive parameter for the effectiveness of the gluing process. Both parameters depend on the settings on the knife ring chipper and change as the knife protrusions in the knife ring wear down.

Objective data for greater process stability

Chip geometry is decisive for the mechanical properties of a particle board. The ratio of chip surface area to chip volume is the decisive parameter for the effectiveness of the gluing process. Chip geometry is determined by the settings on the knife ring chipper. Wear on the knife protrusions during operation causes this important setting to change continuously – and with it the chip geometry. The GreCon 3D PARTICLEVIEW measuring device provides you with the measurement data you need for an objective assessment of chip quality and chip geometry quickly and easily. The knife ring chipper is readjusted as needed, and product quality remains stable.

GreCon PARTICLEVIEW analyses the particle geometry using lasers
GreCon PARTICLEVIEW 3D laboratory chip measurement using laser technology
Video Play button on yellow wall

measurement method

The chips to be measured, which can be taken at any point in the process (after the knife ring chipper, after screening and fractionation into middle and top layer chips), are separated by specially coordinated vibrating conveyors and automatically placed on the measuring conveyor belt. In the measuring area, the chips are measured for length, width and thickness (height) by a line laser in combination with a camera unit. This transports the chips to the measuring area, where they are measured for length, width and thickness (height) by a line laser including a camera unit without contact.

Before:

  • Manual sampling, rough estimates
  • No real-time data
  • Higher glue consumption due to safety reserves

After:

  • Continuous geometry analysis in real time
  • Targeted process optimisation
  • Material savings, better board quality

Integration of GreCon PARTICLEVIEW into a standard process

  • Analysis of your production line and material flows
  • Selection of the appropriate system (2D or 3D)
  • Integration at the ideal installation location
  • Commissioning and instruction
  • Configuration of data connection and visualisation

Understanding chip geometry – for better quality right from the first chip

Ready for your next production advantage?

GreCon PARTICLEVIEW systems bring transparency and control to chipboard production – continuously, precisely and efficiently. See for yourself! Work with our experts to find out how PARTICLEVIEW can improve your production in a targeted manner! We are available to provide you with comprehensive advice.

Contact us – make your production more efficient than ever before!

We look forward to hearing from you.

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